N-type silicon wafer_N-type silicon wafer_ Silicon Wafer_Products

Property

Serial Number	Parameter	Standard	Method
1	Resistivity/Ω.cm	0.4~1.6	Silicon wafer automatic sorting equipment
2	Minority lifespan/μs	≥800	BCT-400 minority carrier lifetime tester
3	Oxygen content/atoms/cm³	≤6.0×10'	Fourier transform infrared spectrometer
4	Carbon content/atoms/cm³	≤5.0×10¹⁶	Fourier transform infrared spectrometer

Inspection content	Silicon wafer edge distance/mm	Diagonal/mm	Chamfer/mm	Verticality/°	Wafer thickness/μm
Technical specifications	182*182±0.25	247±0.25	7.51±0.5	90±0.15	150+10/-10 (Batch ≥ 150 μ m) 140+10/-10 (Batch ≥140μm) 130+10/-10 (Batch ≥130μm) 120+10/-10 (Batch ≥120μm)
	182.2*182.2±0.25		7.72±0.5
	182.2*183.75±0.25		8.52±0.5
	182.2*183.75±0.25	256±0.25	1.99±0.5
	182.2*183.5±0.25	256±0.25	1.89*1.90±0.5
	182.2*191.6±0.25	262.5±0.25	1.38*1.32±0.5
	182*210±0.25	272±0.25	4.57*3.93±0.5
	210*210±0.25	295±0.25	1.44±0.5

Serial Number	Parameter	Standard	Method
1	Cutting method	Diamond wire cutting	/
2	Pattern direction	Parallel to the short side (half piece)	Visual
3	TTV	≤25μm	Silicon wafer automatic sorting equipment
4	Saw mark	≤13μm	Silicon wafer automatic sorting equipment
5	Bend	≤40μm	Silicon wafer automatic sorting equipment
6	Buckling	≤40μm	Silicon wafer automatic sorting equipment
7	Chipping	Depth ≤ 0.3mm and length ≤ 0.5mm Each piece cannot exceed one, with no V-shaped broken edges	Manual or automatic silicon wafer sorting equipment
8	Hidden crack	Not allow	Silicon wafer automatic sorting equipment
9	opening or hole in a utensil	Not allow	Silicon wafer automatic sorting equipment
10	Surface Quality	Clean surface with no visible pollution Oil stains, fingerprints, flower spots, mortar residue, adhesive residue)	Silicon wafer automatic sorting equipment